HiSpeed
Space Saver UV Laser Marking Machine & Laser Engraving Machine
Space Saver UV laser marking machine uses a 355nm source with third-order frequency doubling, offering a smaller spot size to minimize workpiece deformation. Ideal for ultra-fine marking, engraving, packaging, micro-hole marking, glass cutting, and silicon wafer processing.
Key Features
Integrated, Ready to Use
Free Maintenance
No Consumable Parts
High Speed, Stable, Long Life
Space Saving Design
Technical Specifications
| Model | LS-UV-3/5/8/10 |
| Power Options | 3W, 5W, 8W, 10W |
| Wavelength | 355nm |
| Beam Quality (M²) | <1.3 |
| Output Power Range | 10% - 100% |
| Output Frequency Stability | <±2% RMS |
| Power Stability (8h) | <±3% RMS |
| Pulse-to-Pulse Instability | TEM₀₀ (M² <1.3) |
| Spatial Mode | <2 mrad (full angle) |
| Beam Divergence | 0.6 ± 0.1 mrad |
| Beam Diameter | >90% |
| Beam Roundness | <50 μrad |
| Pointing Stability | <50 μrad |
| Polarization Direction | Horizontal |
| Polarization Ratio | 100:1 |
| Cooling Method | Water Cooling |
Applications
Manuals & Guides
No manuals available at the moment